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Semiconductor Manufacturing

Scenarios

01

Wafer Sputtering Coating

02

Chip Packaging and Bonding

03

Photoresist Vacuum Defoaming

04

Semiconductor Packaging Vacuum Molding

05

Wafer Post-Thinning Vacuum Cleaning

Capability Overview

Large units rapidly establish high vacuum to adapt to wafer coating processes. Medium and small pumping speed vacuum pumps achieve precise control for bonding, defoaming and cleaning processes, with low noise to meet clean workshop requirements.
Core Advantages
Multi-cavity compatibility, low noise for clean workshop compliance.

relevant cases

Technical Consulting

Accurate Q&A on Vacuum Technology | Design of Customized Working Conditions | Full Process Guidance on Selection and Adaptation